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Thin Film

Holy Stone provides customization services catered to:
1. Hybrid ceramic substrate
2. Ceramic substrate for optical communication
3. Any high power, small size, high development of life
4. Request for high temperature, high humidity and other harsh environment… etc.
 

Competitive Advantages:
1. Thin Profile
2. Universal High Thermal Conduction
3. Stability
4. Capability for flip chip and eutectic bonding
5. High power durability
6. Similar thermal-expansion coefficient to Chip
 

Holy Stone provides custom design service for ceramic metallized substrates. We possess two different processes of production for thin-film substrate:

1. Ceramic Substrate DCM (Direct Coating Metal) Process flow

 
2. Ceramic Substrate DBC (Direct Bond Copper) Process flow

Contact

> Taiwan
Contact 吳東曜(Bernie Wu)
E-mail berniewu@holystone.com.tw
Phone 886-2-26270383#310