AMB

In addition to the customization of thick film and thin film metallization, Holy Stone can also provide AMB substrates with not only the advantages of ceramic substrate, but high reliability and short lead time.

Features and Advantages

  • The maximum thickness of copper can be reached up to 1mm and meet different design of copper thickness on both sides.
image description
  • Excellent connection leaving no seams.
image description
image description
  • Customized circuit designs or full copper substrates
image description
  • Using Si3N4 substrate contain high strength and high thermal conductivity.
  • According to customer inquiry, we provide the best material combination.

Process Flow

image description

Specifications for Ceramic Substrate

image description

※ Special dimensions on request

Substrate Characteristics

image description

The Capability of AMB Process

image description

※ Other copper thickness on request

Design Rules for Metallization Pattern

image description
image description

※ Special dimensions on request. Surface option by customer request, Electroless Ni/Au, Ag, Ni/Pd/Au… etc.

Reliability Test

image description