In addition to the customization of thick film and thin film metallization, Holy Stone can also provide AMB substrates with not only the advantages of ceramic substrate, but high reliability and short lead time.
Features and Advantages
- The maximum thickness of copper can be reached up to 1mm and meet different design of copper thickness on both sides.
- Excellent connection leaving no seams.
- Customized circuit designs or full copper substrates
- Using Si3N4 substrate contain high strength and high thermal conductivity.
- According to customer inquiry, we provide the best material combination.
Process Flow
Specifications for Ceramic Substrate
※ Special dimensions on request
Substrate Characteristics
The Capability of AMB Process
※ Other copper thickness on request
Design Rules for Metallization Pattern
※ Special dimensions on request. Surface option by customer request, Electroless Ni/Au, Ag, Ni/Pd/Au… etc.
Reliability Test
