PROCESS INTRODUCTION

In LED and VCSEL field, Holy Stone has always focused on technology development and work hard to help customers produce the world’s most extreme ceramic substrates. Through semiconductor-grade equipments, we can assist customers in making metallized circuits with the thinnest thickness of 0.13mm ceramic substrate. The smallest single chip size is controlled at 1.3 mm x 0.8mm, which is a world-class production level. In the future automotive electronics, 5G and precision medical and other high-end chip packaging markets, we take profession, focus and rapid response as our biggest mission to customers.

APPLICATIONS

image description

VCSEL

  • 3D Sensing
  • LiDAR
  • IR Light
  • Fiber-optic communication
  • Laser For Medical
image description

VCSEL

  • PA
  • Fiber-optic communication
image description

Automotive

  • IGBT
image description

Base Station

  • Lightning Protection
image description

LED for Display

  • Micro LED

THIN FILM

Holy Stone has semiconductor-grade equipments for thin-film process, and currently has mass production with the thickness of 0.13mm and the chip size of 1.3mm x 0.8mm which is a world-class production level.

Learn more

THICK FILM

In mature thick-film technology, Holy Stone can make muti-layer structures to meet different packaging requirements and deliver them in the shortest lead time to meet customers’ needs for seizing the market.

Learn more